Semiconductor apparatus with improved ESD withstanding voltage

ABSTRACT

A semiconductor apparatus having an outer ESD protective circuit corresponding to each external connection terminal, the outer ESD protective circuit being formed in a peripheral region around the external connection terminals. The outer ESD protective circuit discharges electrostatic voltage from the external connection terminal and avoids the damaging of an internal circuit of the semiconductor apparatus. Accordingly, the ESD withstanding voltage of the semiconductor apparatus is improved.

TECHNICAL FIELD

The present invention generally relates to a semiconductor apparatus,and more particularly, to a semiconductor apparatus that is providedwith an internal circuit in the central portion of a semiconductor chipand a plurality of external connection terminals in the peripheralportion of the semiconductor chip, wherein a plurality of differentvoltage levels are provided to the plurality of external connectionterminals, and further provided is an electrostatic discharge (ESD)protective circuit to prevent the semiconductor apparatus from beingdamaged by ESD.

BACKGROUND ART

FIG. 9 is a block diagram showing a conventional semiconductor apparatusprovided with an ESD protective circuit.

An analog functional block 105 a and a digital functional block 105 dare formed in an internal circuit 105 formed on a semiconductorsubstrate. The analog functional block 105 a and the digital functionalblock 105 d are electrically connected to each other via an interface111. An analog voltage AVcc as a power supply voltage and an analogground AGND are electrically connected to the analog functional block105 a. A digital voltage DVcc as a power supply voltage and a digitalground DGND are electrically connected to the digital functional block105 d.

An analog pad 109 a is electrically connected to the analog functionalblock 105 a via the ESD protective circuit 107 a. The analog powersupply voltage AVcc and the analog ground AGND are electricallyconnected to the ESD protective circuit 107 a.

A digital pad 109 d is electrically connected to the digital functionalblock 105 d via the ESD protective circuit 107 d. The digital powersupply voltage DVcc and the digital ground DGND are electricallyconnected to the ESD protective circuit 107 d.

The ESD protective circuits 107 a and 107 d are composed of, forexample, metal oxide semiconductor field effect transistors (MOSFETs)and diffusion resistors (for more details, refer to Japanese Laid-openPatent Applications 8-37299, 8-236637, 8-288404, and 9-186296).

FIG. 10 is a circuit diagram showing an equivalent circuit of the ESDprotective circuit 107 a.

The ESD protective circuit 107 a is configured by a protective diode D1formed by an N-channel type MOSFET, a protective diode D2 formed by anN-channel type MOSFET, and a diffusion resistor R.

The diffusion resistor R is provided on the signal line between a MOSFETthat is a portion of the analog functional block 105 a and the analogpad 109 a. The source of the protective diode D1 is connected to theanalog power supply voltage AVcc. The drain of the protective diode D1and the drain of the protective diode D2 are connected to each other,and further connected to the signal line between a diffusion resistor 8b and the analog pad 109 a. The gate electrode of the protective diodeD1, the source of the protective diode D2, and the gate electrode of theprotective diode D2 are grounded.

As the components of large scale integrated circuits (LSIS) becomesmaller, lightly doped drain (LDD) type MOSFETs, of which the ability towithstand ESD voltage is lower than that of single drain structuredMOSFETs, are used more often than ever. Accordingly, it is getting moredifficult to form protective components of the ESD protective circuitwith only MOSFETS.

Further, since the integration scale of LSIs is getting greater, it ispossible to form many system blocks on a single chip wherein manydigital functional blocks and many analog functional blocks aredisposed. In the case of a semiconductor apparatus provided withmultiple digital functional blocks and multiple analog functionalblocks, it is necessary for each functional block to have its own powersupply in order to protect each functional block from the noise oncommon signal lines, for example, and to reduce power consumption of theentire LSI by using and managing multiple power supply voltages. Most ofthe multiple power supply voltages are generated external to the LSI andprovided to the LSI through separate terminals of the LSI.

Further, in the case of a system LSI having an analog functional block,an exclusive power supply system is often used for the analog functionalblock, which requires a small-sized ESD protective circuit. Accordingly,it becomes obvious that the ESD withstanding voltage of such a systemLSI becomes low.

Further, as showed in FIG. 9, in the case of an LSI having multiplepower supply systems, if a large current needs to flow through theanalog pad 109 a, the electrostatic energy cannot be discharged by theESD protective circuit 107 a since the analog power supply AVcc and theanalog ground AGND do not have enough capacity to let the current flow.The electrostatic energy may also be discharged through the digitalpower supply DVcc and/or the digital ground DGND. Thus, the internalcircuit including the interface 111 electrically connecting the analogfunctional block and the digital functional block are damaged by theESD.

DISCLOSURE OF INVENTION

Accordingly, it is an object of the present invention to provide a noveland useful semiconductor apparatus having multiple power supply systemsof which ESD withstanding voltage is improved.

To achieve the above object, a semiconductor apparatus formed on asemiconductor substrate having a first conductivity type, according tothe present invention includes an internal circuit in the centralportion of a semiconductor substrate, a plurality of external connectionterminals formed in a first portion of said semiconductor substratearound said internal circuit, each external connection terminal beingelectrically connected to said internal circuit, wherein a plurality ofpower supplies correspondingly supply different voltage levels to theplurality of external connection terminals, and a plurality of outer ESDprotective circuits formed in a second portion of said semiconductorsubstrate or a common well region in said semiconductor substrate,around said first portion of said semiconductor substrate, wherein eachof said outer ESD protective circuits further comprises a firstdiffusion region electrically connected to one of the externalconnection terminals, a second diffusion region formed separately fromsaid first diffusion region, said second diffusion region beingelectrically connected to a higher voltage line of a main power supply,and a third diffusion region formed separately from said first diffusionregion, at a side of said first diffusion region opposite from saidsecond diffusion region, said third diffusion region being electricallyconnected to a lower voltage line of said main power supply.

The above main power supply refers to, among the multiple power supplysystems, the power supply that supplies power to the largest portion ofthe internal circuit.

According to the present invention, the outer ESD protective circuitconnected to the higher voltage line and the lower voltage line of themain power supply are disposed in a peripheral portion that is closer tothe edge of the semiconductor chip than the external connectionterminals. If electrostatic voltage is introduced through the externalconnection terminal, the electro static voltage is discharged throughthe outer ESD protective circuit so as not to damage the internalcircuit. Accordingly the ESD withstanding voltage of the semiconductorapparatus is improved.

Further, the ESD protective circuit of this structure can bemanufactured by ordinary manufacturing processes of semiconductorapparatuses without adding any special process.

Furthermore, since the ESD protective circuit transfers theelectrostatic energy when the electrostatic voltage exceeds thewithstanding voltage between two diffusion regions instead of electricalswitching, the outer ESD protective circuit does not work under normaloperating conditions. That is, the addition of the outer ESD protectivecircuit does not affect the operation of the internal circuit.

Other objects, features, and advantages of the present invention willbecome more apparent from the following detailed description when readin conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a cross-sectional view showing a semiconductor chip providedwith an ESD protective circuit according to the first embodiment of thepresent invention;

FIG. 2A is a top view showing the entire portion of the semiconductorchip provided with the ESD protective circuit showed in FIG. 1;

FIG. 2B is an enlarged partial top view of the ESD protective circuit ofthe semiconductor chip showed in FIG. 1;

FIG. 3 is a circuit diagram of an equivalent circuit of the ESDprotective circuit according to the first embodiment;

FIG. 4 is a cross-sectional view of a semiconductor chip provided withan ESD protective circuit according to the second embodiment of thepresent invention;

FIG. 5A is a top view of the semiconductor chip provided with the ESDprotective circuit showed in FIG. 4;

FIG. 5B is an enlarged partial top view of the ESD protective circuit ofthe semiconductor chip showed in FIG. 4;

FIG. 6 is a circuit diagram of an equivalent circuit of the ESDprotective circuit according to the second embodiment;

FIG. 7 is a cross-sectional view of a semiconductor chip provided withan ESD protective circuit according to the third embodiment of thepresent invention;

FIG. 8 is a cross-sectional view of a semiconductor chip provided withan ESD protective circuit according to the fourth embodiment of thepresent invention;

FIG. 9 is a block diagram showing a semiconductor apparatus having aconventional ESD protective circuit; and

FIG. 10 is a circuit diagram of an equivalent circuit of theconventional ESD protective circuit.

BEST MODE FOR CARRYING OUT THE INVENTION

The semiconductor apparatus according to the present invention mayinclude a first metal wiring formed in said second portion of saidsemiconductor substrate, wherein said first metal wiring electricallyconnects the second diffusion regions of the plurality of outer ESDprotective circuits to said higher voltage line of said main powersupply, and a second metal wiring formed in said second portion of saidsemiconductor substrate, wherein said second metal wiring electricallyconnects the third diffusion regions of the plurality of outer ESDprotective circuits to said lower voltage line of said main powersupply.

As a result, the metal wiring makes it easy to connect the outer ESDprotective circuits to the higher voltage line and the lower voltageline of the main power supply. Further, since the metal wiring can bedisposed on the semiconductor substrate without crossing other wiring,the area required for the outer ESD protective circuit can be reduced.

The semiconductor apparatus according to the present invention mayfurther include an oxide layer formed on a surface of said semiconductorsubstrate separating said first diffusion region from said seconddiffusion region and said first diffusion region from said thirddiffusion region, a first electrode formed on said oxide layer betweensaid first diffusion region and said second diffusion region, and asecond electrode formed on said oxide layer between said first diffusionregion and said third diffusion region.

As a result, the outer ESD protective circuit can assure that dischargeof the electrostatic noise because of a MOSFET structure using thechannel in the semiconductor substrate or the well region of thesemiconductor substrate just under the oxide layer separating diffusionregions.

In the semiconductor apparatus according to the present invention, it ispreferable that said first diffusion region, said second diffusionregion, and said third diffusion region are single-layered diffusionregions having a second conductivity type. As a result, the arearequired for the outer ESD protective circuit can be reduced.

The semiconductor apparatus according to the present invention mayfurther include one or more extra outer ESD protective circuitscorresponding to each external connection terminal formed in said secondportion of said semiconductor substrate and a common well region in saidsemiconductor substrate or in an extra common well region separatelyformed around said second portion of said semiconductor substrate, theextra outer ESD protective circuits having substantially the samestructure as the outer ESD protective circuit, wherein a seconddiffusion region of the extra outer ESD protective circuit iselectrically connected to a higher voltage line of a power supply otherthan said main power supply, and a third diffusion region of the extraouter ESD protective circuit is electrically connected to a lowervoltage line of said power supply other than said main power supply.

As a result, since electrical paths are established between a pluralityof higher voltage lines and a plurality of lower voltage lines, thedischarging of electrostatic noise for all of the external connectionterminals can be achieved.

In the semiconductor apparatus according to the present invention, it ispreferable that the lower voltage of at least two power supplies is theground voltage level, and the outer ESD protective circuitscorresponding to said at least two power supplies share the same thirddiffusion region electrically connected to the ground voltage level.

As a result, the area required for the outer ESD protective circuit canbe reduced.

The semiconductor apparatus according to the present invention mayinclude a plurality of inner ESD protective circuits on signal linesbetween said internal circuit and the plurality of external connectionterminals, each inner ESD protective circuit being provided with aprotective diode formed by a punch-through transistor having the samestructure as a MOSFET formed in said internal circuit, wherein a drainof said punch-through transistor is electrically connected to the signalline and a gate and a source of said punch-through transistor areelectrically connected to a higher voltage line of a power supplycorresponding to the external connection terminal or said main powersupply.

As a result, the ESD withstanding voltage of the semiconductor apparatuscan be further improved.

FIG. 1 is a cross-sectional view showing a semiconductor chip, of whicha portion is showed as a block, provided with an ESD protective circuitaccording to the first embodiment of the present invention. FIG. 2A is atop view of the semiconductor chip showed in FIG. 1. FIG. 2B is a topview of the ESD protective circuit of the semiconductor chip showed inFIG. 1. FIG. 3 is a circuit diagram of an equivalent circuit of the ESDprotective circuit according to the first embodiment. FIG. 1 is thecross-sectional view at the line X-X in FIG. 2B.

An internal circuit 5 is formed in the central portion of asemiconductor chip 1 made of a P-type semiconductor substrate 3, forexample. A plurality of analog functional blocks and a plurality ofdigital functional blocks are formed in the internal circuit 5.

A plurality of pads (external connection terminals) 9 are formed in theperipheral portion of the semiconductor chip 1. The voltage levelsapplied to these pads 9 range between 0 and 7 volts (V). Depending on ananalog functional block or a digital functional block of the internalcircuit 5 electrically connected to each pad 9, the voltage levelapplied to the pad 9 differs.

An inner ESD protective circuit 7 is provided in the signal line betweenthe inner circuit 5 and the pad 9. The inner ESD protective circuit iscomposed of two protective diodes D1 (high voltage side) and D2 (lowvoltage side) and a diffusion resistor R.

Both protective diodes D1 and D2 are punch-through transistors formed byN-channel type MOSFETs. The diffusion resistor R is provided in thesignal line between the MOSFET 5 d and the pad 9. The source of theprotective diode D1 is connected to Vcc provided by either a digitalpower supply or an analog power supply. The drain of the protectivediode D1 is connected to the drain of the protective diode D2 as well asthe diffusion resistor R and the pad 9. The gates of the protectivediodes D1 and D2, and the source of the protective diode D2 areconnected to the ground.

In the outer region of the semiconductor chip 1 near the pad 9, an outerESD protective circuit 11 is provided for each pad 9. The configurationof the outer ESD protective circuit 11 will be described in detailbelow.

N-type diffusion regions 15, 17, and 19 are formed on a P-typesemiconductor substrate 3 of which density is 7.0×10¹⁴ cm⁻³, forexample. The N-type diffusion regions 15, 17, and 19 are separated fromeach other by an oxide layer 13 450 nm thick. The density of the N-typediffusion regions 15, 17, and 19 is 1.0×10²¹-1.0×10²² cm⁻³, for example.The N-type diffusion regions 15, 17, and 19 are disposed in that orderfrom the pad 9 side to the outer side of the semiconductor substrate.The distance between the N-type diffusion regions 15 and 17, and thedistance between the N-type diffusion regions 17 and 19 are 1.2 μm, forexample.

The N-type diffusion region 17 is electrically connected to thecorresponding pad 9 through metal wiring. The N-type diffusion regions17 of each outer ESD protective circuit 11 are separated from eachother. The distance between 2 adjacent N-type diffusion regions 17 is18.0 μm, for example.

All N-type diffusion regions 15 are continuous and form a stripe-shapedregion in the outer side of the pad 9. The N-type diffusion regions 15are electrically connected to the digital power supply DVcc throughmetal wirings 21 (first metal wirings) common to all outer ESDprotective circuits 11.

All N-type diffusion regions 19 are also continuous and form astripe-shaped region in the outer side of the N-type diffusion region17. The N-type diffusion regions 19 are electrically connected to thedigital ground DGND through metal wirings 25 (second metal wirings)common to all outer ESD protective circuits 11.

As showed in FIG. 2B, the N-type diffusion regions 15 and 19 formstripe-shaped regions along the arrangement of the pads 9. The N-typediffusion regions 15 and 19 of each outer ESD protective circuit 11 areconnected to the metal wirings 21 and 25, respectively, throughcontacts.

In this embodiment, the digital power supply DVcc and the digital groundDGND provide the voltage level of the main power supply that providespower to the largest digital functional block in the internal circuit 5.

A gate electrode 27 is formed on the oxide layer 13 separating theN-type diffusion regions 15 and 17. The gate electrode 27 iselectrically connected to the pad 9 through the metal wiring 29. Anothergate electrode 31 is formed on the oxide layer 13 separating the N-typediffusion regions 17 and 19. The gate electrode 31 is electricallyconnected to the pad 9 through the metal wiring 33. The gate electrodes27 and 31 may be made of metal or poly-silicon, for example.

The P-type semiconductor substrate 3, the N-type diffusion regions 15and 17, the oxide layer 13, and the gate electrode 27 form a MOSFETstructure, and the semiconductor substrate 3, the N-type diffusionregions 17 and 19, the oxide region 13, and the gate electrode 31 alsoform a MOSFET structure.

An inter-layer insulating film and an overcoat (not shown) are formed onthe oxide layer 13, the N-type diffusion regions 15, 17, and 19, and thegate electrodes 29 and 31.

In this embodiment, an electrostatic noise coming from the pad 9 istransferred to the N-type diffusion region 17 and the gate electrodes 27and 31 through the metal wirings 23, 29, and 33, respectively. Theelectrostatic charge in the gate electrode 27 generates a channel (asshowed in FIG. 1 as an arrow “A”) in a region of the P-typesemiconductor substrate 3 just under the oxide layer 13 between theN-type diffusion regions 15 and 17, or the electrostatic charge in thegate electrode 31 generates a channel (as showed in FIG. 1 as an arrow“B”) in a region of the P-type semiconductor substrate 3 just under theoxide layer 13 between the N-type diffusion regions 17 and 19. Theelectrostatic noise is discharged to either the digital power supplyDVcc or the digital ground DGND, depending on which channel, A or B, isgenerated.

Since electrostatic noise is discharged through the digital power supplyline DVcc or the digital ground line DGND, the electrostatic noise, evenif it is applied to a pad 9 connected to an analog functional block,does not damage the internal circuit 5. The ESD withstanding voltage ofthe semiconductor apparatus 1 is improved significantly.

Additionally, the electrostatic noise is also discharged through theinner ESD protective circuit 7, and the ESD withstanding voltage of thesemiconductor apparatus 1 is further improved.

FIG. 4 is a cross-sectional view showing an ESD protective circuitaccording to the second embodiment of the present invention. FIG. 5A isa top view showing a semiconductor apparatus formed on a semiconductorsubstrate of P-type conductivity having the ESD protective circuitshowed in FIG. 4, and FIG. 5B is a top view showing the ESD protectivecircuit showed in FIG. 4. FIG. 6 is a circuit diagram showing anequivalent circuit of the ESD protective circuit showed in FIG. 4. FIG.4 is a cross-sectional view of the ESD protective circuit according tothe second embodiment at the position of a line X-X of FIG. 5B. Acomponent that is identical to one in FIGS. 1 through 3 is referred toby the same numeral and its description is omitted.

The semiconductor chip 1 made of a P-type semiconductor substrate 3, forexample, has an internal circuit 5 at the center. A plurality of pads(external connection terminals) 9 are formed around the internal circuit5. The pad 9 is electrically connected to an analog functional block ora digital functional block of the internal circuit 5, and a differentvoltage level is applied to the pad 9 depending on the functional blockto which the pad 9 is connected. An inner ESD protective circuit 7 isprovided on the signal line between the internal circuit 5 and the pad9.

Outer ESD protective circuits 41 corresponding to the pads 9 are formedon the outside of the pads 9 of the semiconductor chip 1. The structureof the outer ESD protective circuit 41 will be described below.

The outer ESD protective circuit 41 includes a plurality of ESDprotective circuits 41 a, 41 b, . . . , 41 x correspondingly provided tothe 1^(st) power supply, the 2^(nd) power supply, . . . , the x-th powersupply, each outer ESD protective circuit having the same structure asthe outer ESD protective circuit 11 showed in FIG. 1.

Each ESD protective circuit 41 a, 41 b, . . . , 41 x has N-typediffusion regions 15, 17, 19 that are formed on the surface of thesemiconductor substrate 3 and separated by the oxide layers 13. TheN-type diffusion region 17 is electrically connected to a correspondingpad 9 through a metal wiring 23.

Each outer ESD protective circuit 41 a, 41 b, 41 x has gate electrodes27, 31 and metal wiring 29, 33 formed on the oxide layers 13.

The N-type diffusion regions 15 of the outer ESD protective circuits 41a, 41 b, . . . , 41 x form a single continuous stripe-shaped region onthe outside of the pads 9, and are electrically connected to the firstpower supply voltage Vcc1, the second power supply voltage Vcc2, . . . ,the x-th power supply voltage Vccx, respectively, through common metalwiring 21 a, 21 b, 21 x provided to the respective outer ESD protectivecircuit 41 a, 41 b, . . . , 41 x.

The N-type diffusion regions 19 of the outer ESD protective circuits 41a, 41 b, . . . , 41 x form a single continuous stripe-shaped region onthe outside of the pads 9, and are electrically connected to the firstground voltage GND1, the second ground voltage GND2, . . . , the x-thground voltage GNDx, respectively, through common metal wiring 25 a, 25b, . . . , 25 x provided to the respective outer ESD protective circuit41 a, 41 b, . . . , 41 x.

In this embodiment, the electrostatic noise from the pad 9 istransferred to the N-type diffusion region 17 and the gate electrodes27, 31 through the metal wiring 23, 29, and 33. The gate electrode 27forms a channel in the semiconductor substrate 3 just under the oxidelayer 13 between the N-type diffusion regions 15 and 17.

Accordingly, if the power supply voltage is common, the electrostaticnoise is discharged to the power supply lines Vcc1, Vcc2, . . . , Vccxsince the electrostatic noise flows as indicated by arrows A¹, A², . . ., A^(x). If the ground voltage is common, the electrostatic noise isdischarged to the ground lines GND1, GND2, . . . , GNDx since theelectrostatic noise flows as indicated by arrows B¹, B², . . . , B^(x).

As described above, the ESD protective circuit 41 according to thisembodiment forms a plurality of electric paths to the power supply linesor the ground lines to discharge electrostatic noise coming from theexternal connection terminals 9.

FIG. 7 is a cross-sectional view showing an ESD protective circuit 51according to yet another embodiment (third embodiment) of the presentinvention. A component that is identical to one in FIG. 1 is referred toby the same numeral and its description is omitted.

The inner ESD protective circuit 7 is provided on the signal linebetween the internal circuit 5 and the pad 9. An outer ESD protectivecircuit 51 is provided to each pad 9 on the outside of the pad 9. Theouter ESD protective circuit 51 includes N-type diffusion regions 15,17, 19 separated by oxide layers 13. The N-type diffusion region 15 iselectrically connected to the digital power supply line DVcc through ametal wiring 21. The N-type diffusion region 17 is electricallyconnected to the corresponding pad 9 through a metal wiring 23. TheN-type diffusion region 19 is electrically connected to the digitalground line DGND through a metal wiring 25.

In this embodiment, an electrostatic noise from the pad 9 is transferredto the N-type diffusion region 17 through the metal wiring 23. If theelectro static noise exceeds the junction ESD withstanding voltage ofthe P-type semiconductor substrate 3 and the N-type diffusion region 17,the electrostatic noise travels to the P-type semiconductor substrate.

If the power supply is common, the electro static noise traveling to theP-type semiconductor substrate 3 is discharged to the digital powersupply line DVcc (showed as an arrow “A”). This is the same effect asthe forming of a channel at the position of the arrow “A”.

If the ground is common, the electrostatic noise traveling to the P-typesemiconductor substrate 3 is discharged to the digital ground line DGND(showed as an arrow “B”). This is the same effect as the forming of achannel at the position of the arrow “B”.

As described above, even if the ESD protective circuit 51 is notprovided with a gate electrode, the electrostatic noise is discharged.

FIG. 8 is a cross-sectional view showing an ESD protective circuit 61according to yet another embodiment (fourth embodiment) of the presentinvention. A component that is identical to one in FIG. 4 is referred toby the same numeral and its description is omitted. This is a casewherein one of the multi-voltage levels is the ground level.

An inner ESD protective circuit 7 is provided on the signal line betweenthe internal circuit 5 and the pad 9. An outer ESD protective circuit 61is provided to each pad 9 on the outside of the pad 9. The outer ESDprotective circuit 61 will be described below.

The outer ESD protective circuit 61 includes a plurality of ESDprotective circuits 61 a, 61 b, . . . , 61 x correspondingly provided tothe 1^(st) power supply, the 2^(nd) power supply, . . . , the x-th powersupply.

Compared to the structure of the ESD protective circuit 41 a showed inFIG. 4, the structure of the ESD protective circuit 61 a is the same.The GND1 is the ground level. The ESD protective circuits 61 b, . . . ,61 x respectively corresponding to the ESD protective circuits 41 b, . .. , 41 x of the outer ESD protective circuit 41 showed in FIG. 4 are notprovided with the N-type diffusion region 19, the metal wiring 25 b, . .. , 25 x, and electrodes 31.

As described above, if at least two of the lower voltage lines of powersupplies are the ground voltage or the same voltage level, the outer ESDprotective circuits can share the same diffusion region to be connectedto the lower voltage line. Accordingly, the area of the semiconductorchip can be reduced.

In the above embodiments, the N-type diffusion regions 15 and 19 formsingle continuous stripe-shaped regions, respectively. The N-typediffusion regions 15 and 19 of an outer ESD protective circuitcorresponding to each pad, however, may be separate.

In the above embodiments, the outer ESD protective circuit is formed ona P-type semiconductor substrate. The outer ESD protective circuit maybe formed in a P-type well formed in an N-type semiconductor substrate.The outer ESD protective circuit may be formed on an N-typesemiconductor substrate or in an N-type well formed in a P-typesemiconductor substrate. If the outer ESD protective circuit is formedon an N-type semiconductor substrate or an N-type well formed in aP-type semiconductor substrate, the diffusion region is required to beP-type. The diffusion region, whichever N-type or P-type, may bemulti-layered instead of single layered.

The size, values, shape, and disposition described in the aboveembodiments are just examples. The present invention is not limited tothese embodiments, but various variations and modifications may be madewithout departing from the scope of the present invention.

This patent application is based on Japanese priority patent applicationNo. 2001-214111 filed on Jul. 13, 2001, the entire contents of which arehereby incorporated by reference.

1-8. (canceled)
 9. A semiconductor apparatus formed on a semiconductorsubstrate having a first conductivity type, said apparatus comprising:(a) an internal circuit in a first portion of said semiconductorsubstrate; (b) a plurality of external connection terminals formed insaid first portion of said semiconductor substrate, each externalconnection terminal being electrically connected to said internalcircuit; and (c) one or more outer ESD protective circuits formed in asecond portion of said semiconductor substrate around said first portionof said semiconductor substrate.